Dynatron S6 3U Active CPU Heat Sink for LGA4677

Dynatron Support: (510) 498-8888

Dynatron S6 3U Active CPU Heat Sink for LGA4677

SKU:

960-00K12

LGA 4677
Aluminum Fin stack with Heat Pipe embedded
3U Server and Up
TDP: up to 350W

Our Price:	Login to see price
Availability:	Temporarily out of stock

What's New

: Dynatron T17 2U Active CPU Heat Sink for sWRX8/sTRX4/TR4/SP3

Dynatron S6 3U Active CPU Heat Sink designed for Intel Sapphire Rapids Processor, Socket FCLGA 4677 Aluminum Stacked Fins with Heat Pipes directly contact CPU, Active Cooler for 3U Server and up, Support 350 Watts CPU Power Heat Dissipation.

Description

Specifications

Socket Type

FCLGA 4677

Application

3U Server and Up

Heat Sink Type

Aluminum Stacked-Fin with Heat Pipes directly contact CPU

Heatsink Dimension

128 x 91 x 110 mm

Fan Dimension

80 x 80 x 38 mm

Fan Speed

At Duty Cycle 0~20%: 1300± 200 RPM
At Duty Cycle 50%: 2450± 10% RPM
At Duty Cycle 100%: 4500±10% RPM

Fan Noise

At Duty Cycle 0~20%: 23.95 dBA
At Duty Cycle 50%: 37.71 dBA
At Duty Cycle 100%: 50.91 dBA

Fan Air Flow

At Duty Cycle 0~20%: 22.23 CFM
At Duty Cycle 50%: 41.90 CFM
At Duty Cycle 100%: 76.95 CFM

Fan Bearing Type

Double Ball

Connector (s)

4-pin PWM

The above specifications are For reference only. Please contact the original manufacturer For the most updated specifications.

Warranty and Service

Warranty Length: 1 year
Warranty Provider: Dynatron
Service Contact:
1. First 30-day from invoice date: Allstarshop On-line RMA Request
  This item is returnable for replacement only. It can only be exchanged with the same item.
2. After 30-day from invoice date: Contact Dynatron at (510) 498-8888
Technical Support: Dynatron (510) 498-8888 or visit Dynatron technical support online.

Package Contents

Dynatron S6 3U Active CPU Heat Sink