Kingston’s HyperX® T1 series features heat spreaders with HTX (HyperX Thermal Xchange) Technology that makes them literally the coolest for any new rig you may be building.

These high-performance modules are designed with heavy aluminum extrusions with extended fins and other component technology to keep DRAMs cool and modules ready for performance, gaming and overclocking.

Kingston's KHX2000C9D3T1K3/3GX is a triple-channel kit of three 128M x 64-bit 1GB (1024MB) DDR3-2000 CL9 SDRAM (Synchronous DRAM) memory modules, based on eight 128M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel® XMP (Extreme Memory Profiles). Each module kit has been tested to run at DDR3-2000MHz at a latency timing of 9-9-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333Mhz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V.

Kingston’s HyperX® T1 series features heat spreaders with HTX (HyperX Thermal Xchange) Technology that makes them literally the coolest for any new rig you may be building.

These high-performance modules are designed with heavy aluminum extrusions with extended fins and other component technology to keep DRAMs cool and modules ready for performance, gaming and overclocking.