The ASRock Z170 Extreme4+ supports 6th Generation Intel Core Processors (Socket 1151) and comes equipped with XXL Aluminum Alloy Heatsink Design. Extra large heat sinks that effectively take away heat from the MOSFET and chipset so that your motherboard may perform more stable.
High Density Glass Fabric PCB
What you've never understood about your computer is that it is scared to death of water, H2O, humidity or whatever you'd like to name it. And even though you do not see the water, actually there may be lots of excessive moist in the air killing your motherboard silently and slowly. No, your motherboard doesn't melt when in contact with water like the wicked witch of the west, but it dies of short circuit. Luckily, ASRock has a new High Density Glass Fabric PCB design that reduces the gaps between the PCB layers to protect the motherboard against electrical shorts caused by humidity.
USB 3.1 10 Gb/s Type-A + C On the Rear I/O and Front USB 3.1 Panel
This motherboard has a pair of onboard Type-A and Type-C USB 3.1 ports built on the rear i/o for supporting next generation USB 3.1 devices and to deliver up to 10 Gbps data transfer rates.
10 Power Phase Design
The power phase design offers smooth power delivery to the CPU, unmatched overclocking capabilities, lower temperature for advanced gamers, and reinforced system stability for taking on all sorts of arduous computing tasks.
Ultra M.2 32 Gb/s (PCIe Gen3 x4 & SATA3)
The PCIe Gen3 x4 Ultra M.2 interface pushes data transfer speeds up to 32Gb/s. In addition, it also supports SATA3 6Gb/s M.2 modules, and is compatible with ASRock's U.2 Kit for installing some of the world's fastest U.2 PCIe Gen3 x4 SSDs.