Antec's Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7's nano diamond particles minimize the distance between heat-conductive compounds and gladly take on an overclocking environment, optimally performing between -50°C and 250°C. To keep your system cool and your CPU functioning comfortably, pick up Antec's Formula 7 for a diamond-caliber solution.

Features

• Diamond particles measuring 0.0000015 cm rated at 8.3 w/mK


• Extended -30°C to 250°C stable temperature range ideal for performance cooling


• Lighter, easier to spread stable composition won't crack or dry out


• Quantity: 4 g


• Specific gravity: 2.8 g/cm3